- Podnožje releja za montažu na DIN šinu, - Za tip releja: DPDT.

Hemija i potrosni materijal

USB A / micro B kabl za mobilne telefone 3 metra

- Napojni kabl, - Utikač 2.1x5.5mm - USB micro B utikač, - Radni napon: 5V, - Dužina kabla: 0.2m.

- PROSTO USB 2.0 kabel, pogodan za punjenje prenosivih uređaja, prenos i sinhronizaciju podataka, - Za sve uređaje sa USB Lightning (Apple) priključkom, - Fleksibilna i izdržljiva pletena izrada kabela, osigurava dugotrajno korištenje bez upetljavanja, - Visok kvalitet izrade, sa aluminijumskim kućištem i gumenim ojačanjem, garantuje dugotrajnu upotrebu, - Brend: PROSTO, - Tip: Kabel, - Priključak A: 1 x USB A utikač, - Priključak B: 1 x USB Lightning utikač, - Izvedba: Pleteni, - Dužina kabela: 1 m, - Boja: Crno-crvena, - Brzina prenosa podataka: do 480 Mbit/s, - Struja punjenja: do 5V DC / 2.1 A.

Opis proizvoda B-7000 kontaktni lepak je osnovni izbor za popravku okvira mobilnog telefona, stakla, plastike, kože, drveta, tkanine; njegova koncentracija čvrstih materija, vreme stvrdnjavanja i viskoznost čine ga odličnim univerzalnim lepkom. Funkcije:Otporan na voduBez ostataka prašinePrecizni aplikator sa dizajnom igle u poklopcu kako bi se sprečila blokada. Brzo i lako čišćenje prelivanjaBrzo se stvrdnjava za 3-6 minuta (zavisno o materijalu)Specifikacije:Sadržaj čvrstih materija: 30% - 35%Boja: ProvidnaVeličina / Količina tečnosti: 15mlKoncentracija / Viskoznost: 2800mpa. sTemperaturni opseg: -35 stepeniC ~ +90 stepeniCVreme stvrdnjavanja: 4-6 minuta (Brzo) 24-48 sati (Potpuno)

ESP8266 is a highly integrated chip designed for the needs of a new connected world. It offers a complete and self-contained Wi-Fi networking solution, allowing it to either host the application or to offload all Wi-Fi networking functions from another application processor. ESP8266 has powerful on-board processing and storage capabilities that allow it to be integrated with the sensors and other application specific devices through its GPIOs with minimal development up-front and minimal loading during runtime. Its high degree of on-chip integration allows for minimal external circuitry, and the entire solution, including front-end module, is designed to occupy minimal PCB area. Features SDIO 2.0, SPI, UART 32-pin QFN package Integrated RF switch, balun, 24dBm PA, DCXO, and PMU Integrated RISC processor, on-chip memory and external memory interfaces Integrated MAC/baseband processors Quality of Service management I2S interface for high fidelity audio applications On-chip low-dropout linear regulators for all internal supplies Proprietary spurious-free clock generation architecture Integrated WEP, TKIP, AES, and WAPI engines Solutions Supports APSD for optimal VoIP applications Patented spurious noise cancellation algorithm for integration in SOC applications Supports Bluetooth co-existence interface Self-calibrated RF to ensure optimal performance under all operating conditions Zero factory tuning No external RF components Specifications 802.11 b/g/n Wi-Fi Direct (P2P), soft-AP Integrated TCP/IP protocol stack Integrated TR switch, balun, LNA, power amplifier and matching network Integrated PLLs, regulators, DCXO and power management units +19.5dBm output power in 802.11b mode Power down leakage current of <10uA Integrated low power 32-bit CPU could be used as application processor SDIO 1.1/2.0, SPI, UART STBC, 1×1 MIMO, 2×1 MIMO A-MPDU & A-MSDU aggregation & 0.4ms guard interval Wake up and transmit packets in < 2ms Standby power consumption of < 1.0mW (DTIM3)

Varijanta modula sa prikljuckom za eksternu antenu ovakvog tipa: https://www.kupindo.com/Elektronika/27164545_%E2%99%A6-3dbi-antena-za-ESP8266-ili-slicne-module-%E2%99%A6 ESP8266 is a highly integrated chip designed for the needs of a new connected world. It offers a complete and self-contained Wi-Fi networking solution, allowing it to either host the application or to offload all Wi-Fi networking functions from another application processor. ESP8266 has powerful on-board processing and storage capabilities that allow it to be integrated with the sensors and other application specific devices through its GPIOs with minimal development up-front and minimal loading during runtime. Its high degree of on-chip integration allows for minimal external circuitry, and the entire solution, including front-end module, is designed to occupy minimal PCB area. Features SDIO 2.0, SPI, UART 32-pin QFN package Integrated RF switch, balun, 24dBm PA, DCXO, and PMU Integrated RISC processor, on-chip memory and external memory interfaces Integrated MAC/baseband processors Quality of Service management I2S interface for high fidelity audio applications On-chip low-dropout linear regulators for all internal supplies Proprietary spurious-free clock generation architecture Integrated WEP, TKIP, AES, and WAPI engines Solutions Supports APSD for optimal VoIP applications Patented spurious noise cancellation algorithm for integration in SOC applications Supports Bluetooth co-existence interface Self-calibrated RF to ensure optimal performance under all operating conditions Zero factory tuning No external RF components Specifications 802.11 b/g/n Wi-Fi Direct (P2P), soft-AP Integrated TCP/IP protocol stack Integrated TR switch, balun, LNA, power amplifier and matching network Integrated PLLs, regulators, DCXO and power management units +19.5dBm output power in 802.11b mode Power down leakage current of < 10uA Integrated low power 32-bit CPU could be used as application processor SDIO 1.1/2.0, SPI, UART STBC, 1×1 MIMO, 2×1 MIMO A-MPDU & A-MSDU aggregation & 0.4ms guard interval Wake up and transmit packets in < 2ms Standby power consumption of < 1.0mW (DTIM3)