AMD Phenom II Triple-Core Mobile N830 - HMN830DCR32GM , ispravan. Type CPU / Microprocessor Market segment Mobile Family AMD Phenom II Triple-Core Mobile Model number ? N830 CPU part number HMN830DCR32GM is an OEM/tray microprocessor Stepping codes AADHC AD NADHC AD Frequency ? 2100 MHz Bus speed ? One 1800 MHz 16-bit HyperTransport link (3.6 GT/s) Clock multiplier ? 10.5 Package 638-pin lidless organic micro Pin Grid Array (UOL638) AMD Package number 30605 Socket Socket S1 (S1g4) Size 1.38` x 1.38` / 3.5cm x 3.5cm Weight 0.2oz / 5.7g (measured) 0.2oz / 6.5g (by specifications) Introduction date May 12, 2010 End-of-Life date Last order date is 3rd quarter 2011 Last shipment date is 1st quarter 2012 Architecture / Microarchitecture Microarchitecture K10 Platform Danube Processor core ? Champlain Core stepping ? BL-C3 CPUID 100F53 Manufacturing process 0.045 micron silicon-on-insulator (SOI) technology Data width 64 bit The number of cores 3 The number of threads 3 Floating Point Unit Integrated, 128-bit wide Level 1 cache size ? 3 x 64 KB 2-way set associative instruction caches 3 x 64 KB 2-way set associative data caches Level 2 cache size ? 3 x 512 KB 16-way set associative caches Level 3 cache size None Cache latency [1] 3 (L1 cache) 15 (L2 cache) Multiprocessing Uniprocessor Features MMX instructions Extensions to MMX 3DNow! technology Extensions to 3DNow! SSE / Streaming SIMD Extensions SSE2 / Streaming SIMD Extensions 2 SSE3 / Streaming SIMD Extensions 3 SSE4a ? AMD64 / AMD 64-bit technology ? EVP / Enhanced Virus Protection ? AMD-V / AMD Virtualization technology Low power features PowerNow! Integrated peripherals / components Integrated graphics None Memory controller The number of controllers: 1 Memory channels: 2 Supported memory: DDR3-1333, DDR3L-1066 Maximum memory bandwidth (GB/s): 21.3 Other peripherals HyperTransport technology 3.0 Electrical / Thermal parameters Thermal Design Power ? 35 Watt